Polishing Compound – Fine Cut – 32ozThis advanced fine cut, anti-hologram polish removes polishing haze and swirl marks for a 100% hologram-free finish. Featuring next-gen, self-grinding alumina abrasives, it’s safe for all paint types – fresh, cured, and scratch-resistant. Water-based, silicone- and solvent-free.Features:Effectively removes hologramsFree of solvents and siliconeAppearance: Cream/PasteSolubility:N/ApH: 8Use & Application:For the DiTEC Fine Cut Compound, we recommend using the DiTEC Red Trapez foam polishing pad.Application: Apply a sufficient amount of the polishing compound to the polishing pad or to the painted surface. Spread the compound at a low speed (about 1000 rpm) on the defect and at about 1600 rpm using moderate pressure. Specifications:Type: Restoration & CompoundsBox Dimensions: 3″H x 3″W x 10″L WT: 2.35 lbsUPC: 850019168440Owner’s Manual (pdf)Brochure (pdf)